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EPYC Venice enters commercial production with up to 256 Zen 6 cores on 2nm and two distinct memory bandwidth tiers reaching 1.6 TB/s per socket.
By co-designing NVHBM with Samsung and TSMC, Nvidia forces two rival foundries to collaborate on a single chip, and rewrites the rules for the entire HBM supply chain.
KIOXIA's LD4 SSDs in E1.L form factor deliver up to 122.88TB in a single 1U server. What this unprecedented density means for infrastructure teams.
Vultr's first commercial deployment of the AMD Helios AI Rack, a $1.2 billion HPE order, marks the arrival of a credible rack-scale alternative to NVIDIA.
Three times faster than the M890, T-Head's Zhenwu V900 can unify 500,000 accelerators in a single cluster. Mass production targets Q1 2027.
Fujitsu launches MONAKA in November 2026: a 144-core ARM processor at 2nm delivering 2x AI inference throughput at half the power draw of comparable CPUs.
The CS-4 fields three 46,000 mm² wafer-scale processors against GPU clusters, 30x faster per user, 10x more energy-efficient than its predecessor.
Sony and TSMC are forming a $4.7bn joint venture in Kumamoto to mass-produce next-generation image sensors from 2029, a direct strike at Samsung.
As HBM demand strains standard DRAM supply, three PC giants quietly source chips from China's CXMT, a critical signal for IT procurement teams.
The NVIDIA–SK Group megadeal reveals that HBM4 memory is the real constraint shaping AI infrastructure, and what CIOs need to factor into their roadmaps.
TSMC's record Arizona investment isn't just a U.S. story, it's reshaping the global map of advanced chip manufacturing for the next decade.
The Broadcom-Apple deal extended to 2031 proves that vertical integration has hard limits, even for the world's most valuable company.
Fueled by AI demand, DRAM prices have quadrupled in just three quarters. Apple is already passing the bill on, and enterprise IT teams won't be spared.
