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EPYC Venice enters commercial production with up to 256 Zen 6 cores on 2nm and two distinct memory bandwidth tiers reaching 1.6 TB/s per socket.
CVE-2026-97631, scored 9.5/10, exposes any PXE network-booting server to code execution before the OS or Secure Boot even initializes.
By co-designing NVHBM with Samsung and TSMC, Nvidia forces two rival foundries to collaborate on a single chip, and rewrites the rules for the entire HBM supply chain.
KIOXIA's LD4 SSDs in E1.L form factor deliver up to 122.88TB in a single 1U server. What this unprecedented density means for infrastructure teams.
In just a few years, Lucid Motors went from projecting 90,000 deliveries to fewer than 3,000 per quarter. A lesson every tech decision-maker should study.
Vultr's first commercial deployment of the AMD Helios AI Rack, a $1.2 billion HPE order, marks the arrival of a credible rack-scale alternative to NVIDIA.
Three times faster than the M890, T-Head's Zhenwu V900 can unify 500,000 accelerators in a single cluster. Mass production targets Q1 2027.
Fujitsu launches MONAKA in November 2026: a 144-core ARM processor at 2nm delivering 2x AI inference throughput at half the power draw of comparable CPUs.
The CS-4 fields three 46,000 mm² wafer-scale processors against GPU clusters, 30x faster per user, 10x more energy-efficient than its predecessor.
Sony and TSMC are forming a $4.7bn joint venture in Kumamoto to mass-produce next-generation image sensors from 2029, a direct strike at Samsung.
As HBM demand strains standard DRAM supply, three PC giants quietly source chips from China's CXMT, a critical signal for IT procurement teams.
A firmware macro bug introduced in 2021 degraded cryptographic entropy in Coldcard wallets, and an attacker swept 1,196 addresses in just 41 minutes.
The NVIDIA–SK Group megadeal reveals that HBM4 memory is the real constraint shaping AI infrastructure, and what CIOs need to factor into their roadmaps.
TSMC's record Arizona investment isn't just a U.S. story, it's reshaping the global map of advanced chip manufacturing for the next decade.
IBM's July 2026 stock crash reveals a structural shift: enterprise CIOs are urgently reallocating capex toward AI hardware, squeezing software budgets.
The Broadcom-Apple deal extended to 2031 proves that vertical integration has hard limits, even for the world's most valuable company.
Fueled by AI demand, DRAM prices have quadrupled in just three quarters. Apple is already passing the bill on, and enterprise IT teams won't be spared.
Jalapeño, OpenAI's custom inference ASIC built with Broadcom, promises to cut LLM running costs in half. Here's what CIOs need to factor in.
