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Fujitsu launches MONAKA in November 2026: a 144-core ARM processor at 2nm delivering 2x AI inference throughput at half the power draw of comparable CPUs.
The CS-4 fields three 46,000 mm² wafer-scale processors against GPU clusters — 30x faster per user, 10x more energy-efficient than its predecessor.
Sony and TSMC are forming a $4.7bn joint venture in Kumamoto to mass-produce next-generation image sensors from 2029 — a direct strike at Samsung.
As HBM demand strains standard DRAM supply, three PC giants quietly source chips from China's CXMT — a critical signal for IT procurement teams.
A firmware macro bug introduced in 2021 degraded cryptographic entropy in Coldcard wallets — and an attacker swept 1,196 addresses in just 41 minutes.
The NVIDIA–SK Group megadeal reveals that HBM4 memory is the real constraint shaping AI infrastructure — and what CIOs need to factor into their roadmaps.
TSMC's record Arizona investment isn't just a U.S. story — it's reshaping the global map of advanced chip manufacturing for the next decade.
IBM's July 2026 stock crash reveals a structural shift: enterprise CIOs are urgently reallocating capex toward AI hardware, squeezing software budgets.
The Broadcom-Apple deal extended to 2031 proves that vertical integration has hard limits — even for the world's most valuable company.
Fueled by AI demand, DRAM prices have quadrupled in just three quarters. Apple is already passing the bill on — and enterprise IT teams won't be spared.
Jalapeño, OpenAI's custom inference ASIC built with Broadcom, promises to cut LLM running costs in half. Here's what CIOs need to factor in.
